Licensable TSV interconnect technology supports high-yield processes

Licensable TSV interconnect technology supports high-yield processes

Amidst arrivals of proprietary, internal through-silicon-via (TSV) interconnect solutions by STMicroelectronics and Aptina Imaging (a Micron Technology arm dedicated to imaging and wafer-level cameras), miniaturization technologies IP provider Tessera is claiming the industry’s first TSV technology that is licensable and supportive of high-yield manufacturing processes. The company promises its Shellcase MVP wafer-level chip-scale package (WLCSP) technology can meet the reliability, cost, and size pressures associated with industry demand for more-advanced image-sensor packaging technologies.

The beauty of Tessera’s latest Shellcase technology, the MVP, is it’s licensable.

“Our Shellcase MVP brings innovative via-through-pad technology to the market,” said Bents Kidron, vice president, wafer-level packaging technologies, Tessera. “Not only will it decrease overall manufacturing costs with the added benefit of supporting legacy systems, but the technology will also provide a longer-term manufacturing roadmap with its support for 3D stacking of the image senor and other ICs, such as DSP and flash memory.”

Announced at Image Sensors Europe in March 2008, the WLCSP solution also allows manufacturers to use image IC sensor wafers without modifying the chip design. “This is a generic packaging solution,” Kidron said. “We don’t ask the image-sensor manufacturers to do anything.” Visit http://www.tessera.com/technologies/products/wafer_level_csp for more information.

Ralph Raiola