Littelfuse introduces two series of 0.5pF, 12kV TVS Diode Arrays designed to prevent ESD damage to high-speed interfaces

SP7538P Series TVS                          SP0544T Series TVS

Littelfuse, Inc., the global leader in circuit protection, has introduced two series of TVS Diode Arrays (SPA® Diodes) designed to safeguard many of the latest high-speed interfaces from damage due to electrostatic discharges (ESD).  

SP7538P Series TVS Diode Arrays integrate eight channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode in a µDFN-9 package; SP0544T Series TVS Diode Arrays have a similar design but are smaller, with four channels of ultra-low capacitance rail-to-rail diodes instead of eight. Both of these robust device series can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. Their extremely low loading capacitance also makes them ideal for protecting high-speed signal pins.  

Typical applications for both series include ESD protection for interfaces like V-By-One, Embedded DisplayPort, USB 2.0/3.0 Ports, and HDMI, as well as flat panel displays, LCD/LED TVs, smartphones and mobile computing.  

“The SP7538P and SP0544T Series are appropriate for use in many of the same applications,” said Tim Micun, product manager/TVS Diode Arrays (SPA® Diodes). “The SP7538P Series is designed to permit straight-through routing for ultra-high-speed signals on DisplayPort and V-by-One interfaces, requires no fan out or fan in, and mates perfectly with the pitch on the board-to-board connectors. The SP0544T Series offers the same level of ESD performance as our earlier low capacitance TVS Diode Arrays, in a smaller outline, offering circuit designers a PCB space savings of roughly 25 percent.” 

SP7538P and SP0544T Series TVS Diodes offer these key benefits: 

 • Their extremely low loading capacitance of 0.5pF (typ) per I/O reduces signal degradation and distortion for high-speed applications.

 • They offer low dynamic resistance (0.4Ω), which provides low clamping performance to ensure better protection for sensitive chipsets.

 • Their enhanced ESD capability (±12kV contact, ±25kV air) permits manufacturers to achieve ESD protection beyond the maximum level stated in the IEC standard and protects against a multitude of other threats to ensure product reliability in the field.