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LLP-W – Link Layer Processor-Wireless

The LLP-W offers a highly integrated solution for multiservice applications such as wireline access network and 2.5G/3G wireless access applications. The full bidirectional data bandwidth of the LLP-W can be used entirely by a single protocol path or can be simultaneously partitioned among the three protocol paths, allowing migration from circuit switching (TDM) to cell switching (ATM) to packet switching (IP) on a common platform.


The LLP-W device supports multichannel ATM transmission convergence (TC), inverse multiplexing for ATM (IMA), ATM adaptation Layer type 1 segmentation, reassembly (AAL1 SAR), multichannel high-level data link control (HDLC), and multilink/multiclass point-to-point protocol (ML/MC/PP) data-link layer functions. This rich protocol support makes the LLP-W an ideal device for wireless 2.5G/3G radio access network and wireline access network applications.

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