MEMS switches boost accuracy, channel density in ATE systems

Analog Devices Inc. (ADI) has introduced two RF MEMS switches that allow OEMs to significantly improve the accuracy and versatility of automatic test equipment (ATE) and other instrumentation tools.

ADI’s ADGM1304 and ADGM1004 RF MEMS switches replace electromechanical relays with a co-packaged solution that offers superior dc precision and RF performance. ADI claims that these MEMS switches are 95% smaller, 30 times faster, 10 times more reliable, and use 10 times less power than conventional relays.

It's a two-die RF MEMS device. The first one is an electrostatically actuated switch in a hermetically sealed silicon cap. The second die is a low-voltage and low-current driver IC. The switching element features a highly reliable metal-to-metal contact, which is actuated via an electrostatic force generated by the companion driver IC.

The packages for ADGM1304 and ADGM1004 MEMS switches boast small height, and that allows designers to surface-mount them on both sides of ATE test boards. That, in turn, boosts channel densities at reduced cost and without an increase in the instrumentation equipment footprint.

Next, an integrated charge pump removes the need for external drivers. And that further reduces ATE system size and simplifies the fan-out structure. ADI says that these MEMS breakthroughs extend cold-switching lifetime by a factor of 10 compared to conventional relays.

Moreover, ADGM1304 and ADGM1004 RF MEMS switches increase ATE system operating life and reduce costly downtime caused by electromechanical relay failures. ADI is planning to offer these MEMS switches to other industries such as aerospace, defense, healthcare, and communications infrastructure.