A series of low-profile metallic foam heatsinks deliver unmatched thermal performance for today’s space-constrained applications. The LPH00xx series of micro-porous copper and foam heatsinks from Versarien use homogenously distributed interconnected pores to present a large surface area for enhanced heat dissipation. The combination of surface area and the thermal conductivity properties of copper enable the height of these heatsinks to be markedly reduced without sacrificing operational performance levels.
The metallic foam heatsink products are designed for use in passive cooling applications where long-term reliability is vital, but available space is extremely limited. They enable the efficient cooling of sophisticated semiconductor components in densely-packed electronics systems. You can expect to see it used for board-level components, FPGA cooling, wearable technologies, automotive designs, telecom, automation, and medical devices. The device provides higher performance cooling in low-profile passive environments, enabling smarter, more compact designs and allows engineers to push the boundaries of passive cooling. Versarien: http://www.versarien-technologies.co.uk
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