Mezza-pede® low profile 1.0mm pitch SMT Connectors from Advanced are designed for board-to-board or flex cable-to-board applications where long-term reliability is required. With Advanced's enclosed screw-machined socket, 6-finger contact and heavy gold plating, Mezza-pede® Connectors pass the 20-day mixed flowing gas (MFG) test required in many telecom and other severe environment and long-life applications.
An over-molded lead frame seals the surface mount leads to prevent solder wicking, ensuring a secure solder joint. The low 4mm stack height makes it ideal for tight mezzanine packaging applications. Mezza-pede SMT Connectors are specified in the OIF Micro Integrable Tunable Laser Assembly Implementation Agreement and are available in standard and custom configurations.
Features
– Low profile – board to board stack height of only 4.0mm (nom.).
– Robust design features screw-machined terminals and multi-finger contacts with a per contact current rating of greater than 1 Amp at 80°C ambient.
– Dual row configurations include 8, 14 or 36 total positions with other pin counts available on a customized basis.
– SMT and thru-hole designs available.
– Passed 20-Day MFG test with heavy Gold terminal plating (GH).
– Qualified for use in telecommunications applications.
– RoHS Compliant.
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