Hirose has launched a stackable ball grid array (BGA) mezzanine connector for high-speed and high-density server applications. The IT14 Series supports data transmission up to 56 Gbits/s NRZ /112 Gbits/s PAM4 for telecom and networking applications.
(Source: Hirose)
The Ethernet OAM specified connector uses a high-density design (172 DPs/in2) to meet telecom and networking application requirements. It features a stub-less two-point contact design for high reliability and a protective housing encapsulates the contact tips to prevent warping during mating, said Hirose. The contact plating is gold.
The hermaphroditic IT14 Series connectors also reduce costs and increase reliability thanks to a self-mating design, which eliminates the need for additional mating parts. In addition, the high- speed differential and ground contacts are placed alternately in each row to eliminate cross talk, according to the company.
The IT14 connectors measure 68 × 20.1 × 4.92 mm and are available with 688 positions. The contact pitch is 0.9 mm. Key specs include a rated current of 1.2 A, a rated voltage of 30 VAC/DC, an operating temperature range of -55℃ to 105℃ and 100 mating/unmating cycles. The contact resistance is 30-mΩ maximum, the insulation resistance is 500 VDC for 1 minute and the withstanding voltage is 1000 MΩ (500 VDC).
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