MicroTCA Summit shows off latest trends

The MicroTCA Summit (May 28 to 30) will put forth discussions and demonstrations of the latest trends regarding MicroTCA systems, including the latest processors, the newest interfaces, the most-demanding high-availability applications, and the latest next-generation wireless networks.

The summit will feature half-day tutorials, keynotes and panel discussions, a special working session, a special market research session: directions in MicroTCA, and, finally, an analyst session: The future of MicroTCA. Here is just a sampling of the products that will be available for you to view on the exhibit floor.

Advantech (www.advantech.com, Booth 218) will be showing a carrier hub that enables flexible and scalable solutions with platform economics in mind. The UTCA-5503 provides an adaptive carrier infrastructure for reliable AdvancedMC interoperability, from basic carrier management with OpenHPI support to Gigabit Ethernet or PCI Express Switching. AMCC (www.amcc.com, Booth 301) will have its Linux-based Arches AMC card reference design incorporating two 1-GHz PowerPC 460GT processors. Gigabit Ethernet, serial RapidIO, and PCI-Express ports are provided to the backplane, while serial ports and additional GbE ports are connected to the front panel. A production version of the card is available from AMCC’s partner, Silicon Turnkey Express.

CorEdge Networks (www.coredgenetworks.com, Booth 311) will introduce a Cavium Networks OCTEON Multicore MIPS64 processor-powered daughter card option for its CEN-RL20TM 20-Gbit/s AdvancedMC line card. The module adds deep packet inspection and encryption/decryption capabilities to the card which features a Xilinx Virtex-5 LX110T FPGA. Elma Electronic Inc. (www.elma.com, Booth 205) will have 1U MicroBox offered as a fully integrated solution, with the smallest form factor of any deployable MicroTCA unit available. The 19-in. rack-mount MicroBox features up to 10 modules.

Emerson Network Power (www.emersonnetworkpower.com, Booth 315) will show the Centellis 500 low-cost fully deployable MicroTCA system with a list price of $5,000. The unit uses innovative plastic packaging, Emerson’s MicroTCA Carrier Hub, and a high-performance processor module. Also on display will be PrAMC-6210, a dual-core processor-based AMC card. Enea (www.enea.com, Booth 201) wants you to see Element 3.0—an advanced middleware platform for building MicroTCA-based carrier grade network equipment. Element’s network supervision, fault management, and shelf management services enhance service availability by making it easier to monitor, repair, configure, and upgrade live systems.

GoAhead Software (www.goahead.com, Booth 111) will show the SAFfire high availability and management middleware that offers designers and developers of carrier-grade and mission-critical systems a sophisticated approach to ensuring continuous service availability while still focusing resources on innovation and faster-time-revenue. HARTING (www.harting-usa.com, Booth 306) will have its new plug connector for AdvancedMC modules. The rugged two-piece connector system brings a new level of reliability to applications. Soldered onto the mating edge of the AMC module, the plug connector reduces insertion forces and guarantees 200 mating cycles.

Interphase (www.interphase.com, Booth 300) will demo the iSPAN 36CA AdvancedMC four-port GbE packet-processing card with a high-capacity line rate engine for use in AdvancedTCA and MicroTCA systems. It addresses the needs of IPSEC acceleration, policy management, and routing and content inspection and management in 3G/4G, IMS and VoIP infrastructure.

Kaparel (www.kaparel.com, Booth 315) will present a MicroTCA 5U shelf designed as a compact solution for flexible and cost-critical applications. AdvancedMC modules are plugged directly into a high-speed backplane without a carrier card.

Molex (www.molex.com, Booth 304) will show standard and custom, reliable MicroTCA interconnects designed to support next generation 10/12.5 Gbit/s native channels. They target wireless infrastructure, wireline networking and fiber optic networking equipment.

Pinnacle Data Systems (www.pinnacle.com, Booth 305) will show the new AMC-A2 AMC processor module with an AMD Athlon dual-core CPU that provides high performance, low power, and long lifecycle for demanding telco applications. The tightly integrated design couples the processor directly to the Broadcom HT1100 south bridge to pack high performance into the compact AMC form factor.

Yamaichi (www.yeu.com, Booth 110) will have it’s new dual-slot AMC connector that can stack two mid-size modules at 1U height, using their unique compression mount technology.

Jim HarrisonThe MicroTCA Summit will be held May 28 to 30 at the Marriott Westfields, Chantilly, VA (Washington DC). For more information, visit www.microtcasummit.com.