A miniature SMT test point, Catalog No. 5029, features a symmetrical flat-wire design that enables high-strength test point-to-PCB bonding with a minimal footprint. The low-profile ISO-9001-certified and RoHS-compliant device accepts a variety of gripping probes to replace wire-wrap posts and turret terminals to test the circuitry of high-density PCB packages.
Phosphor bronze and silver plate construction accommodate the use of both lead-free solder and traditional reflow processing. Packaging is on tape and reel, compatible with most vacuum and mechanical pick-and-place assembly systems. (Contact company for pricing — available now.)
By Carolyn Mathas
Keystone , Astoria , NY
Sales 800-221-5510
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