MOSFET package enables high power dissipation

MOSFET package enables high power dissipation

The Dual Cool packaging for MOSFETs is a top-side cooling PQFN device that incorporates new packaging technology that enables additional power dissipation through the top of the package. The packaging features an exposed heat slug that delivers a significant reduction in thermal resistance from junction to top of case, resulting in 60% higher power dissipation capability than standard PQFN packaging when a heat sink is mounted. The MOSFETs in the Dual Cool package are designed with proprietary PowerTrench process technology that enables lower RDS(on) and higher load currents in smaller package sizes.

The MOSFET packaging for top-side cooling are available in Power33 (3.3 x 3.3-mm) and Power56 (5 x 6-mm) packaging options. The FDMS2504SDC, FDMS2506SDC, FDMS2508SDC, FDMS2510SDC (5 x 6 mm) and the FDMC7660DC (3.3 x 3.3 mm) suit synchronous rectifying MOSFETs for dc/dc converters, telecom secondary side rectification, and high-end server/workstation applications. (Ea/1,000: FDMS2504SDC, $4.14; FDMS2506SDC, $3.46; FDMS2508SDC, $2.70; FDMS2510SDC, $2.08; FDMC7660DC, $1.38 — available now.)

Fairchild Semiconductor , South Portland , ME
Sales 207-775-8100
www.fairchildsemi.com