By Gina Roos, editor-in-chief
Kemet Corp. has added the company’s KONNEKT high-density packaging technology to its family of KC-LINK capacitor range to meet growing demand in wide-bandgap (WBG) semiconductors, electric vehicles/hybrid electric vehicles, LLC resonant converters, and wireless charging applications.
The new surface-mount multi-chip solution combines the KC-LINK’s proprietary C0G base metal electrode (BME) dielectric system with KONNEKT’s transient liquid phase sintering (TLPS) material, targeting high-density packaging and high-efficiency applications. The multi-chip device delivers up to 4× the capacitance compared to a single multilayer ceramic capacitor. The mechanical robustness allows KC-LINK capacitors with KONNEKT to be mounted without the use of lead frames, which results in extremely low effective series inductance (ESL), said Kemet, increasing the operating frequency range and allowing for further miniaturization.
The solution delivers thermal stability and mechanical robustness through increased efficiency by combining multiple capacitors into a single high-density, ultra-low-loss package, said Dr. John Bultitude, Kemet vice president and Technical Fellow.
In addition, the capacitors using KONNEKT technology have the unique ability to be mounted in a low-loss orientation to further increase their power-handling capability, said Kemet. The low-loss, low-inductance package is capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature.
Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors in high-power-density applications, which require minimal cooling. Target growth applications in the DC/DC converter market include aerospace, medical, and automotive.
Available in commercial grade with tin termination finish, this series is Pb-free and RoHS- and REACH-compliant. The devices are available through Kemet’s distribution network.
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