New products roundup: Passives, interconnects, power, SSDs, and thermal management

Here is this week’s roundup of new products, including Wi-Fi 6 IP for access points and a 176-layer NAND solid-state drive (SSD). Listed in alphabetical order by company name, this week’s new products roundup also covers AC/DC power supplies, BGA sockets, common-mode filters, DC/DC converters, heat sinks, and power MOSFETs.

Advanced Thermal Solutions, Inc. (ATS) now offers pin- and slant-fin heat sinks made from lightweight, extruded aluminum for low-cost cooling. Pin fin heat sinks offer a high efficiency design that uses cooling airflow from any direction. They operate in spatially-constrained PCB layouts where the airflow direction is variable. The pin fin field features low pressure drop characteristics for cooling in low airflow environments. The large surface areas of the pins and base increase overall heat sink performance, said ATS. For limited airflow environments in direction-specific applications, slant fin heat sinks are said to provide substantial surface area for high cooling performance. The slanted fin field extends slightly beyond their base dimensions. Both heat sinks are fabricated from single-piece extruded aluminum, which minimizes the thermal resistance from their base to their fins, said ATS. They are available for component sizes 10 × 10 mm up to 60 × 60 mm and standard heights from 2 to 25 mm. Standard-sized heat sinks can be attached with double-sided thermal tapes, while larger heat sinks can be further secured with clip-type hardware, including Z-clips, and the company’s maxiGRIP and superGRIP attachment systems.

Astrodyne TDI  has introduced the EDP125 Series of desktop AC/DC power supplies. These external adapter power supplies are designed for applications with power-efficient and low leakage requirements for medical, health-care, and industrial applications. The EDP125 series delivers 125 watts (W) of regulated DC output power and operates over the input voltage range of 80 to 264 VAC, at 47–63 Hz frequency. Each model includes built-in short circuit, overload, overvoltage, and overtemperature protection. The power supplies are safety certified for both Class I grounded and Class II ungrounded AC inputs and are certified to meet stringent requirements in medical applications including home health-care equipment and the latest DoE Level VI efficiency requirements. They are approved for the following standards: IEC62368 and IEC 60950 I.T.E. Safety, IEC 60601-1-1, 3rd Edition, Amendment 1 Medical Safety, and IEC 60601-1-2, 4th Edition, Class B Medical EMC. The EDP125 Series is available through Digi-Key or on the Astrodyne TDI website.

Ceva, Inc. has expanded its RivieraWaves Wi-Fi IP family with the introduction of the RivieraWaves Wi-Fi 6 access point (AP) IP. Extending its Wi-Fi portfolio for the AP market, the new Wi-Fi 6 AP IP leverages the latest advanced features of the IEEE 802.11ax standard for Wi-Fi in smart home, industrial, automotive, and IoT applications. Wi-Fi 6 delivers advanced features such as multi-user orthogonal frequency division multiple access (OFDMA) downlink and uplink as well as multi-user MIMO for high efficiency and low latency. The RivieraWaves Wi-Fi 6 AP IP delivers a complete digital PHY and MAC layers solution for IEEE 802.11ax in a 2×2 configuration, supporting up to 160-MHz bandwidth and a throughput of up to 2401 Mbits/s (at MCS11-2SS-160MHz). It supports a toolbox of AES-CCM/GCMP, RC4, and WPI crypto accelerators and some key features to enhance medium usage like the preamble puncturing, target wake time (TWT), fragmentation, and 1024 QAM. It also includes an advanced PTA function for smooth co-existence with Bluetooth. It is provided with an integration-ready platform containing an optional open-source RISC-V processor and is operating-system-agnostic. It is available for licensing now.

CUI Inc., a Bel group company, has expanded its line of PRQ isolated DC/DC converters, which provides a lower cost alternative to VHK models and high-wattage power solutions, said CUI. The PRQ150W-D/T/DIN and PRQ200W-D/T/DIN are EN 62368-1 certified 150-W and 200-W quarter-brick DC/DC converters housed in fully encapsulated aluminum alloy cases. Applications include datacom, telecom, robotics, and industrial applications that require a lot of power in a small package. The DC/DC converters are certified to UL 940V-0 flammability rating and EN 62368-1 and include over-current, over-voltage, and short-circuit protection. They offer up to 91% efficiency. Key features include a single regulated output, a five-sided shield, and an ultra-wide 4:1 input range. They are available through CUI’s distribution network, including Arrow, Digi-Key, Farnell, and Mouser. Contact the company for OEM pricing and/or modified or custom designs.

Elma Electronic has introduced a new 3U 12-slot backplane that meets The Open Group Sensor Open Systems Architecture (SOSA) Technical Standard 1.0. The 3U OpenVPX backplane offers a mix of plug-in card (PIC) slots that enable complex, high-speed signal processing and system development, supporting up to 100 Gigabit Ethernet. The backplane supports high-speed signals on all the data paths as well as incorporates VITA 67.3 connectors compatible with legacy VITA 67.1 and VITA 66.4 RF and optical I/O connectors. The backplane features precision network timing (PNT) plus the integration of mixed payload modules including SBCs, switches, radial clocks, and system expansion, and a range of OpenVPX slot profiles. The backplane provides a dual domain architecture that supports MORA, ML2B, and Victory Messaging. Target applications include  Modular Open Systems Approach (MOSA)-aligned open standards-based military computing systems that require high-speed data communications for sensor-based systems.

Infineon Technologies AG has released its new PQFN 2 × 2 mm² OptiMOS 5 25-V and 30-V power MOSFET family. The new OptiMOS 5 power MOSFETs have been optimized for synchronous rectification in switched mode power supply (SMPS) for servers, telecom bricks, portable chargers, and wireless charging. The power MOSFET is also designed for electronic speed controls (ESC) for small brushless motors in drones that require smaller form factors and lighter components, said the company. The PQFN 2×2 devices are said to deliver a new power density and energy efficient dimension with the industry’s lowest on-state resistance, said Infineon. The PQFN 2×2 25 V provides an  RDS(on) of 2.4 mΩ, while the PQFN 2×2 30 V provides an  RDS(on) of 3.6 mΩ

Ironwood Electronics has recently introduced a new BGA socket design that is constructed with a high performance and low inductance elastomer contactor. The GT-BGA-2164 socket is designed for the 23 × 23 mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed with a screw down lid and 12-W heat sink with fan. The contact resistance is typically 30 milliohms per pin. It is mounted on the target PCB with no soldering, and uses very small real estate allowing capacitors/resistors to be placed  nearby. Other passive components can be placed on the back side of PCB by creating custom cutouts in the stiffener plate, said Ironwood. The operating temperature range is -55°C to 160°C. Pricing for the GT-BGA-2154 is $1,486 for a single quantity. Reduced pricing is available depending on the quantity.

Micron Technology, Inc. has claimed the first 176-layer NAND solid-state drive (SSD) for the data center. Sampling now, the Micron 7450 SSD with NVMe delivers quality-of-service (QoS) latency at or below 2 milliseconds (ms), a wide capacity range and U.3, M.2, and E1.S form factor options. This vertically-integrated data center SSD includes Micron’s NAND with 176 layers of storage cells and CMOS-under-the-array technology, integrated with Micron’s own DRAM, internally developed SoC, and associated firmware. The 7450 SSD achieves latency at or below 2 ms for 99.9999% QoS in common, mixed, and random workloads, and compared to SATA SSDs, latency is reduced by nearly 50%, and read bandwidth is improved by up to 12 times, according to Micron. The capacity range is from 400 GB to 15.36 TB, including a capacity of 8 TB in a small E1.S form factor. For security, Micron SSDs offer self-encrypting drive functionality and Microsoft eDrive options that help protect against data breaches and tailor security to specific data protection requirements. Micron’s Secure Execution Environment (SEE) provides dedicated security processing hardware with physical isolation. The Micron 7450 SSD also supports Open Compute Project (OCP) deployments for qualified environments. It will be available for purchase through distribution in April.

TDK Corp. has released the KCZ1210DH series of miniaturized common-mode filters in a 1210 case size (1.25 × 1.0 × 0.5 mm)for automotive applications. This series provides a noise control function for high-speed differential transmission signal lines for vehicles and supports signals with over 10 Gbits/s transmission rates. Common-mode filters are used in autonomous vehicle camera signal lines as anti-noise products, said TDK, and an increase in advanced driver-assistance systems (ADAS) has led to increased demands for forward-sensing cameras and around-view monitors. It protects against product cracks from thermal shock and provides higher durability from mechanicals stresses like substrate strains, thanks to a conductive resin-based electrode and operating temperature from -55°C to 125°C, according to TDK. In addition to ADAS applications, they can be used in high-speed interfaces, HDMI1.4/ 2.0, LVDS/MIPI D-PHY, USB 3.0 /3.1 Gen1, USB 3.1 Gen2, and Next Gen Interface.

Vishay Intertechnology, Inc. has introduced the latest device in its fourth generation of 600-V E Series power MOSFETs. The Vishay Siliconix n-channel SiHK045N60E, housed in the PowerPAK 10×12 package, is said to cut on-resistance by 27% compared with previous-generation 600-V E Series MOSFETs while delivering 60% lower gate charge, delivering the industry’s lowest gate charge times on-resistance for devices in the same class. This device and upcoming releases in the fourth-generation 600-V E Series family address the need for efficiency and power density improvements in the first stages of the power system architecture — power factor correction and hard-switched AC/DC converter topologies. Built on Vishay’s latest energy-efficient E Series superjunction technology, the SiHK045N60E features low typical on-resistance of 0.043 Ω at 10 V and ultra-low gate charge down to 65 nC. The device’s FOM of 2.8 Ω*nC is 3.4 % lower than the closest competing MOSFET in the same class and provides low effective output capacitance Co(er) of 117 pF. “These values translate into reduced conduction and switching losses to save energy,” said Vishay. The SiHK045N60E’s thermal resistance RthJC of 0.45 °C/W is said to be 11.8% lower than the closest competing device for a higher thermal capability. These devices target telecom, server, and datacenter power supply applications. Samples and volume production is available now.

Other new products covered this week include the following:

Renesas launches MPUs based on 64-bit RISC-V CPU core

Mixed signal oscilloscopes add 5G NR analysis software

13-MP camera kit runs on multiple platforms via USB port

Kyocera AVX adds fine-pitch board-to-board battery connectors

Qualcomm unveils next generation modem-RF system with AI

Bourns adds three semi-shielded power inductors

ST claims first 0.5-MP depth image sensor

Here is a link to last week’s product roundup.