In this paper the latest IGBT and free wheel diode chip technologies are utilized in new industrial IGBT modules with reduced size and weight. Chip technology refinement and optimization are employed to provide a reduction of static and dynamic losses. A new package with a novel insulation and heat radiating structure that provides expanded chip mounting area will be presented. It will be shown that the maximum current rating available in a given package size can be increased up to 200% compared to conventional module designs while at the same time the module weight can be reduced by up to 45%.
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