By Gina Roos, editor-in-chief
NI recently released software enhancements for its semiconductor test system (STS) for RF, mixed-signal, and MEMS semiconductor devices. The NI STS provides software tools that help test engineers to develop, debug, and deploy test programs. The enhancements include improvements in programming and debugging, test execution speed, parallel test efficiency, and overall equipment efficiency, while enabling semiconductor companies to reduce the cost of testing.
The latest software release, STS Software 2019, offers several user improvements. These include a simplified driver experience for programming duplicate instruments and easier digital scan support. It also improves the debugging experience so users can perform interactive measurements and debug automated tests in multi-site applications by selecting the device under test (DUT) sites and pins. Tools include pin mapping, test limit importing/exporting, binning, and STDF reporting.
In addition, test throughput is improved through optimized instrumentation drivers for accelerated test execution times and enhanced thread management for improved parallel test efficiency. Other benefits include shortened software changeover time for improvements in overall equipment efficiency, which is particularly important when switching tester configurations between lots.
The software upgrade also offers users who do not have access to the tester an improved offline experience for developing test programs.
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