The surface-mounted TP-107 and TP-108 Series of PCB test points are available with a 0.0001-in. minimum silver-over-0.00005-in. copper plate. The test points are formed using a proprietary flat-wire design in a spiral wrap on the mounting base, which results in an adhesion to the solder pad requiring in excess of 18 lbs. of force to dislodge.
The test points are plated with a 0.0001-minimum matte tin finish over a 0.0001-nickel underplate, and recommended mounting pad dimensions are 0.185 x 0.135 in. The test points suit a range of applications that abide by the current RoHS Directive 2002/95/EC as well as REACH Regulations EC 1907/2006. (Contact Chris Minter for pricing and availability.)
By Christina D’Airo
Components Corp. , Denville , NJ
Christopher Minter 888-397-1694
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