Phase-change materials fit Intel Penryn chip

Phase-change materials fit Intel Penryn chip

Optimized for Intel’s Penryn Quad-core mobile processor, the T-pcm 670 and T-pcm 680 thermal phase-change interface materials soften at regular chip operating temperatures to fill microscopic irregularities found in the surfaces of the microchip package and heat sink. The proprietary mix of thermally conductive fillers and resins minimizes resin migration and pump-out to extend device life.

The phase change materials are inherently tacky to facilitate application and handling. (Contact Sales for pricing and availability.)

Laird Technologies , St. Louis , MO
Information 800-843-4556

http://www.lairdtech.com