PICMG’s COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor, announced in June 2022. The consortium for the development of open embedded computing specifications said this was done in record time and documentation is underway.
This milestone enables PICMG members to start design work on compliant modules, so they will be available to embedded OEMs and developers shortly after the specification launch.
PICMG COM-HPC Mini form factor (Source: PICMG)
“The pinout approval is an essential milestone as carrier board designers and computer-on-module manufacturers such as congatec, who are active in the COM-HPC working group can now embark on first compliant small-form-factor-sized embedded and edge computer solutions based on this pre-approved data,” said Christian Eder, director product marketing congatec, and chairman of the COM-HPC working group, in a statement. “The goal is to bring modules to market at the same time as Intel and other application processor vendors launch their new high-end processor generations, which is expected to happen next year.”
The COM-HPC Mini working group is comprised of 15 member companies and is sponsored by Adlink, Kontron, and congatec. These companies defined the mechanics and pinout of the credit-card-sized high-performance computer-on-modules standard in 12 weeks. The group expects to have a published specification by the second quarter of 2023.
The COM-HPC Mini pinout specification defines the use of one connector instead of the two that are used for the larger COM-HPC Client and Server modules (Sizes A -E), similar to the COM Express Mini compared to COM Express Type 6, said PICMG. “But with COM-HPC, half the number of signal pins still means 400 signal lanes, which equals 90% of the capacity that COM Express Type 6 modules provide,” said PICMG.
The COM-HPC Mini standard provides 400 pins, as compared to COM Express Mini’s 220 pins. Extensions include up to 4× USB 4.0 with full functionality including Thunderbolt and DisplayPort alternate mode, PCIe Gen 4/5 with up to 16 lanes, and 2× 10 Gbits/s Ethernet port. It is also qualified for bandwidths of more than 32 Gbits/s, which can support PCIe Gen 5 or even Gen 6, said congatec.
The COM-HPC Mini offers a 50% smaller footprint compared to COM-HPC Client Size A modules, targeting high-end embedded computer logic in devices such as top-hat rail PCs for control cabinets in building and industrial automation, or portable test and measurement devices.
The new specification will enable the integration of next generation computer interface technologies such as PCIe Gen4 and Gen5 into ultra-small processing units with high performance, said PICMG. Complying with the entire COM-HPC ecosystem, PICMG expects the new spec will become the high-end standard on top of PICMG’s earlier COM Express Mini standard.
Congatec COM-HPC Mini with carrier and HSP. Click for a larger image. (Source: congatec)
Designed for performance-hungry applications, the COM-HPC Mini specification will enable the development of ultra-powerful microcomputers with the size of a 4- or 8-port Ethernet switch, for example, said congatec. These small system sizes are needed in many segments of embedded and edge computing, including box PCs and control cabinet/DIN-rail PCs, adaptive IoT gateways for the brownfield, cyber-secure edge computers for critical IT/OT infrastructures, rugged tablets, ultra-rugged robots, and in-vehicle computers, added the company.
Congatec said it already has a ready-to-deploy COM-HPC Mini design study, based on the 12th Gen Intel Core processor series, for initial testing.
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