Designed for cryogenic applications, the EP29LPSP two-component epoxy adhesive/sealant withstands temperatures as low as 4 K. Additionally, it is able to resist cryogenic shocks.
The compound has a mix ratio of 100 to 65 by weight, cures at room temperatures, and bonds to a variety of substrates including metals, glass, ceramics, and plastics. The material has a mixed viscosity is 400 cps, a tensile strength of 6,500 psi, and a tensile modulus in excess of 375,000 psi. Volume resistivity is greater than 1,015 Ω-cm, dielectric constant is 3.6, and Shore D hardness of 80. (Contact James Brenner for pricing and availability.)
Master Bond , Hackensack , NJ
James Brenner 201-343-8983
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