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Connector mfrs. join to offer AMC, MicroTCA products

Connector manufacturers Molex and Samtec recently announced a joint effort to offer AdvancedMC (AMC.0 B+) and MicroTCA connectors that are identical in form, fit, and function to ensure an increased supply and availability to this growing market. “Molex developed AMC.0 B+ and MicroTCA interconnect solutions to truly optimize cost and performance for current and future telecommunications and datacom systems,” said Joe Dambach, product development manager at Molex.

Liquid cooling co. targets data centers, telecom

Vette Corp., a thermal-management-solutions company based in Manchester, NH, recently started a new division focused on providing liquid cooling for communications services facilities and data centers, including high-density server, storage, and telecommunications equipment. The division will use the company’s manufacturing, engineering, and supply-chain logistics resources to accomplish the task.

“The formation of our datacom facilities division…resulted from our ongoing focus on thermal challenges that our OEM customers are now experiencing in facilities where their equipment has been installed,” said President and CEO George Dannecker. “Data center cooling for high-density data processing equipment has become increasingly complex and expensive. Highly reliable, effective and efficient liquid cooling solutions will replace traditional cooling methods to solve the thermal management needs of our clients.”

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