RP-HL13.OCT
Power devices are packaged in plastic DIPs
Mixed-signal parts integrate DMOS transistors and 1-micron CMOS logic
The Power+ Logic devices from Texas Instruments Inc. are claimed to be
the industry's first power devices in dual in-line packages. Compared to
using bipolar peripheral drivers, the single-chip parts provide up to a
65% reduction in power dissipation and a 100 to 1,000 times reduction in
power supply consumption. The mixed-signal devices integrate
high-performance, double-diffused metal-oxide semiconductor (DMOS) power
transistors and 1-micron CMOS logic on the same substrate. The on-board
power transistors are capable of driving inductive, capacitive, and
resistive loads including motors, solenoids, lamps, and relays, while the
CMOS inputs allow direct interfacing with microprocessors. The
mixed-signal process used in fabricating the devices was designed for use
with the company's PRISM methodology for circuit design. The modular
nature of devices resulting from this methodology is intended to enable
very short development cycles. Cell-based designs that incorporate the
PRISM methodology are compatible with existing cell libraries. The first
devices in the Power+ Logic family are the TPIC6259 8-bit addressable
latch, the TPIC6273 octal D-type flip-flop latch, and the TPIC6595 8-bit
shift register. The parts are available in plastic DIPs. ($1.60 ea/1,
000–available now.) Texas Instruments Inc., Dallas, TX Semiconductor
Group (SC-92074) 214-995-6611, ext. 3990
CAPTION:
The Power+ Logic devices integrate high-performance DMOS power
transistors and 1-micron CMOS logic on the same substrate.
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