Power Integrations Expands DC-DC Converter IC Family To Enable Low-Profile Designs for PoE and PoE-Plus

Power Integrations Expands DC-DC Converter IC Family To Enable Low-Profile Designs for PoE and PoE-Plus

Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for power conversion, announced today the expansion of its DPA-Switch® family of integrated circuits, introducing a low-profile option for the Power over Ethernet (PoE) market and other high-voltage DC-DC applications. The new ultra-low-profile S-PAK package gives a footprint saving of 40% and a height reduction of 55% compared to the existing TO-263 package, while offering equivalent thermal impedance.

Lead-Free S-PAK Package Reduces Both Footprint and Height in Space-Constrained Designs.

PoE enables the delivery of power to networked devices such as IP phones, wireless access points and security cameras, eliminating the need for an AC power connection. By integrating most of the complex aspects of DC-DC power conversion onto a monolithic chip, DPA-Switch ICs enable PoE converters with lower component count, smaller board footprint and shorter design cycles compared to discrete designs and competing IC-based solutions.

Supplied with a 100% matte tin finish, the new S-PAK (JEDEC MO-169) package, which is designated by the letter S in the part number, is lead-free, RoHS compliant and meets J-STD-020C 260 ºC solder reflow requirements. In addition to the S-PAK, DPA-Switch devices are available in DIP-8, SMD-8 and six-lead TO-263 versions.