Power MOSFET innovative packaging reduces top-side thermal impedance

Power MOSFET innovative packaging reduces top-side thermal impedance

The CSD16325Q5C DualCool NexFET is presented as the industry’s first family of standard-footprint power MOSFETs. It dissipates heat through the top of the package, provides up to 50% more current through the device than standard packaging, and improves thermal impedance to the top of the package from 15°C/W to 1.2°C/W, increasing power dissipation capability by up to 80%.

The family of five NexFET MOSFETs target desktop personal computers, servers, telecommunications or networking equipment, base stations, and high-current industrial systems. They feature single-phase 35–A synchronous buck converter MOSFETs, using single MOSFETs for both the high- and low-side switches in high-current dc/dc applications. Dual-side heatsinking enables up to 50% more current through the FET. The devices are available in an industry-standard SON package in a 5 x 6–mm footprint. ($1.47 ea/1,000 — available now.)

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