Power electronics involves a whole range of critical applications, from electrification to smart grids. It is a fundamental pillar for the entire industry to meet climate change demands. The PowerUP Expo 2022 takes place virtually from June 28–30. The technical conference will feature several topic-specific sessions of keynotes, panel discussions, technical presentations, and tutorials about major technical trends, market requirements, and new application areas. In addition to the conference, there will be an exhibition hall, featuring virtual booths from leading power electronics companies, as well as a chat tool enabling visitors to directly connect with each other, with the hosts, and with the exhibiting companies.
Wide-bandgap semiconductors
All industrial sectors, including the consumer sector, are driven by efficiency. Efficiency in electronic systems can contribute to performance restrictions and shorter service life. GaN and SiC power devices are advancing beyond various applications due to their smaller size, weight, and cost, as well as improved efficiency. The global SiC and GaN scenes have been defined by progress and expanding industrial adoption in recent decades. In the meantime, other semiconductor devices handle motor control and driving. Cost-effective and energy-efficient control solutions, test and measurement solutions, and transducers/sensors simplify design and give a high degree of integration as efficiency criteria for these applications increase.
On the first day, you may watch presentations on demand, and if you have any questions, you may come back June 29–30 to chat with the speakers. The preview is online for 24 hours. On June 28, several lectures will play during the day. In particular, Victor Veliadis, IEEE Fellow, executive director and CTO of PowerAmerica, and professor in electrical and computer engineering at North Carolina State University, will review key aspects of SiC fabrication technology and outline non-CMOS compatible processes that have been streamlined to allow for mass SiC device fabrication in standard Si fabs.
Marco Palma, director of motor drive systems and applications at EPC, will review the performance of GaN in motor drives. He will give a lecture titled “Integrated Circuit GaN inverter for Motor Drive Applications above 1 kW.”
Satya Dixit, board member and advisor at Future Semiconductor Business (FSB), will review the available methods currently in practice and the new and upcoming technologies in creating GaN membranes to apply to future applications.
Peter Gammon, professor of power electronic devices at the University of Warwick and founder of PGC Consultancy, will review work on the development of high-voltage MOSFETs, superjunction devices, and bipolar devices (IGBTs and thyristors) up to voltage ratings of more than 20 kV. Finally, another application that remains relatively unexplored is SiC’s use in space, requiring radiation-hardened devices.
Then Martin Schulz, global principal of application engineering at Littelfuse, will get into details of conducting the correlated measurements as well as offer insight into the way a lifetime can be predicted. The procedures described will also reveal the kind of information needed to achieve a high level of confidence for the statement on lifetime.
For the complete article, please visit Power Electronics News.
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