Product Update:
Cooling devices
A sampling of recently introduced products
Tube-axial fan boosts
static pressure
Measuring 6.75 x 5.92 x 2.0 in. and available in two versions, the MagnumT 170 Series tube-axial fan delivers twice the static pressure of similarly sized fans. The solid-state 24-Vdc version weighs 2.4 lb, provides 365 cfm airflow, and features locked-rotor shutdown protection.
The I2 C version weighs 2.1 lb, delivers 512-cfm airflow, and offers microprocessor-controlled circuitry. Both versions are housed in a single-piece aluminum body and feature high-temperature polymer propellers and a brushless stainless-steel motor. (From $375 to $1,000�available now.)
Ametek Rotron
Woodstock, NY
Information 866-768-7668
Fax 760-633-1806
http://www.rotronmilaero.com
Copper cold plate
suits water coolant
Featuring an all-copper construction, the Ascent liquid-cooled cold plate is fully compatible with water and other common coolants, eliminating the need for an inhibitor. The cooling device features an internal crisscrossed fin structure that increases surface area and improves thermal resistance to 0.58°C in�/W�60% better than equivalent aluminum parts.
Featuring a mounting surface of 63.5 (L) x 33.3 (W) mm, the cold plate provides a pressure drop of 3 psi at 0.5 gpm. The device's gull-wing shape facilitates mounting and keeps fluid connections above the plane of the board. ($150�available now.)
Lytron, Woburn, MA
Zarina Bhimani 781-970-6282
Fax 781-935-4529
Heat sink suits
AMD Opteron, Athlon 64
Designed for AMD's Opteron and Athlon 64 processors, the PB64-1U Cooler heat sink dissipates up to 90 W at 40°C. Suited for a 1U form factor, the heat sink features a copper base and a high-density array of copper fins.
Two dual-intake blowers are integrated to provided forced convection, as well as offer redundancy. Attached to the CPU using a standard mounting plate, the device offers a thermal resistance of 0.32°C/W. ($70�evaluation units available now, production units 1 to 2 months ARO.)
Enertron, Mesa, AZ
Dan Nelson 480-649-5400
Heat sink suits
AMD processors
Designed for compatibility with Socket A-type motherboards, the SLK-900A copper heat sink suits AMD processors including Athlon XP Palamino, Thoroughbred, and Barton 2800+. With a 96 (L) x 59 (W) x 44 (H) mm top and 34 (L) x 59 (W)-mm base, the heat sink weighs 527 g.
The heat sink features a 92 x 92 x 38-mm 12-V fan that provides 110.18-cfm airflow. The fan runs at 4,800 rpm and features a noise level of 55 dBA. ($49.95�available now.)
Thermalright
Berkeley, CA
Jim Wei 909-597-7003
Fax 909-606-6919
http://www.thermalright.com/slk900a.html
Solid-state heat pump
suits laser-diode chips
A subassembly comprises a solid-state heat pump mounted to a TO-style header for stabilizing temperatures in laser-diode chips. The header accommodates up to 10 pins for multimode laser applications.
The pump includes mounting pads that accommodate a surface-mount temperature sensor and laser-diode chips. Bond pads enable automatic bonding of the heat-pump lead connections. (Less than $25 ea/10,000�available now.)
Redfish Photonics
Santa Rosa, CA
Information 707-545-9800
Fax 707-545-9801
http://www.redfishphotonics.com
Thermal grease
is silicone-free
The T-grease 2500 line of thermal grease provides a thermal conductivity of 3.8 W/mK and a thermal resistance of 0.017°C-in.2 /W. The silicone-free grease eliminates migration issues typical in silicone-based materials.
Available in 1-, 3-, and 10-kg containers as well as custom-packaged syringes, the material claims to be priced 30% to 50% lower than the competition. (Per kilogram, $150�available now.)
Thermagon, Cleveland, OH
Kelly Resler 888-246-9050
Fax 216-939-2310
Fans employ
magnetic field
The MagLev line of fans uses a built-in magnetic field that eliminates wobble and vibration, as well as reduces bearing wear. Providing from 0.4 to 49-cfm airflow, the fans operate at noise levels as low as 9 dBA.
The fans come in sizes from 17 x 17 x 8 mm to 92 x 92 x 25 mm. (From $2�stock to 10 weeks ARO.)
Sunon – KSM Electronics
Ft. Lauderdale, FL
Bob Glaser 800-327-8914
http://www.ksmelectronics.com
Fan/heat sink cools
100-W electronic loads
The DTL-HS100D12 cooling assembly integrates a fan assembly sitting atop a heat sink capable of cooling 100-W loads. The unit is designed for cooling electronic loads, which get mounted to the bottom of the assembly.
Packaged in a 2.5 x 2.5 x 4.45-in. finned housing, the device offers a thermal resistance of 0.392°C/W and a thermal rise of 38.2°C at 100 W. The fan is powered via 12 Vdc. ($23 ea/100�stock to 4 weeks ARO.)
Datel, Mansfield, MA
Sales 800-233-2765
Fax 508-339-6356
One-piece Al heat sink
improves performance
The DCC heat sink features a fin array and base forged from a solid piece of highly thermally conductive aluminum that eliminates performance degradation typical in two-piece constructions. Available in heights of 10.8, 17.8, 22.8 mm, the heat sink comes in two versions (L and U) that each offer two different fin orientations.
Designed for applications that have a relatively low airflow, the L pattern creates less pressure drop than denser patterns. The U pattern suits applications that require higher performance. ($2 to $3�stock.)
Alpha Novatech
Santa Clara, CA
Information 408-567-8082
http://www.alphanovatech.com
Quiet fans come
in new sizes
The Panther line of dc fans now features versions in form-factor sizes from 60 to 92 mm. The fans operate at switching levels above 20 kHz, producing a soft commutation that is above human audibility.
At fixed low speeds, the fans provide reduce sound pressure levels by 1 to 3 dB. The fan features a single-phase motor and a bipolar drive. ($4 to $6�available now.)
JMC Products
Austin, TX
Erin Mosty Wofford 512-834-8866
Fax 512-834-8868
Enclosure air conditioner
monitors ambient temp
The AHP-301FF/85F enclosure air conditioner integrates a control sensor that cycles the unit when ambient temperatures reach 85°F. The preset thermostat is included at no extra cost.
The unit provides a cooling capacity of 160 to 200 BTU/hr. The air conditioner operates at 120 or 240 Vac. ($595�2 weeks ARO.)
Teca, Chicago, IL
Jeff Semler 888-TECA-USA
Fax 773-342-0191
Heat exchangers feature
rugged construction
The 730 Series liquid-to-air tubed heat exchangers feature a stainless-steel construction that enables them to withstand demanding cooling requirements, such as high-purity deionized water or corrosive fluids. The units feature gold-irridite-finished aluminum frames, as well as riffled and corrugated copper fins.
The devices are manufactured with fan-plenum and mounting fixtures. (From $160 to $800�1 to 3 weeks ARO.)
Thermatron Engineering
Methuen, MA
Dan DeFreitas 978-687-8844
Fax 978-687-2477
Thermoelectric A/Cs
cool to 180 W
The PowerCool line of thermoelectric air conditioners provides cooling power from 40 to 180 W. The units can be used for both cooling and heating.
Designed for applications such as telecom cabinets, the line includes versions for air, liquid, and direct cooling. (Air-to-air, 100-W, 24 Vdc, $390 ea/250 to 499�stock.)
Supercool US
Long Lake, MN
Will Mielenz 800-311-9055
Fax 952-745-9381
Miniature copper heat sinks
are industry's first
Available in heights from 0.15 to 0.8 in. and in footprints from 0.25 to 0.752 in.2 , the UltraCool IV copper pin-fin heat sinks are the industry's first designed specifically for miniature applications. With a thermal resistance from about 2.5° to 55°C/W, the heat sinks dissipate heavy heat loads that typically require larger sinks in devices exposed to air speeds up to 400 lfm.
The devices are constructed from oxygen-free copper using cold-forging technology, ensuring no air bubbles, cracks, or holes occur within the heat sinks. Pin counts range from 4 to 121, although the heat sinks are customizable. (From $0.75 ea/prod qty�available now.)
Cool Innovations
Concord, Ontario, Canada
Sales 905-760-1992
http://www.coolinnovations.com
BGA heat sinks enable
no-tools assembly, rework
The Solder Anchor line of BGA semiconductor heat sinks feature a unique wire clip design that provides a no-tools-required environment for board assembly and rework operations. Available for semiconductor package sizes from 23 to 43 mm2 in pin heights from 10 to 35 mm, the heat sinks' unique design offers cost savings by allowing maintenance without damage to the pc board or its components.
Available in black anodized, green anodized, and clear anodized finishes, the heat-sink solder anchors are soldered to the pc board prior to attaching the heat-sink clip. Each heat sink uses a phase-change pad as the interface to optimize thermal performance. (From $1 ea/10,000�stock.)
Aavid Thermal Technologies
Concord, NH
Cheri Lamy 603-224-9988
Fax 603-224-1749
Chip-cooling fans suit
pc-chassis apps
Designed for chip-cooling applications, the 2806KL and 2810KL 70-mm fans provide up to 27- and 31-cfm airflow, respectively. The fans can also be used for cooling pc chassis and set-top boxes.
Both fans feature optional tach output and locked rotor alarm signals. ($5�available now.)
NMB Technologies
Chatsworth, CA
Information 800-662-8321
Fax 818-341-8207
Dc fans offer
low noise levels
Available in sizes of 40, 60, 80, 92, and 120 mm, the FBA/FBK dc rotary fan series features units with noise levels as low as 21 dBA. With some fans in the series running at speeds up to 9,500 rpm, top airflow levels reach 114.7 cfm.
The fans operate at voltages of 5, 12, or 24 V. (From $5.70 ea/100�stock to 12 weeks ARO.)
Cornell Dubilier
Liberty, SC
Jim Navarro 317-275-2295
http://www.cornell-dubilier.com
Unreinforced adhesive
improves wet-out
Designed to attain high bond strength during long-term exposure to heat and high humidity, the Bond-Ply 400 pressure-sensitive adhesive tape's un-reinforced design provides wet-out and thermal performance improvements. The white material is available in thicknesses of 3, 5, 8 and 10 mils and offers a thermal conductivity of 0.4 W/mK.
Suitable for securing heat sinks or heat spreaders to a variety of components or pc-boards, the adhesive provides a thermal performance of 5.4°C/W. (Per sq. in., $0.15/5,000�available now.)
Bergquist, Chanhassen, MN
Terry Solberg 952-835-2322
Fax 952-835-0430
http://www.bergquistcompany.com
Gap-filler pad improves
compressibility
The ThermaSoft 200 Series thermal gap-filler gel pad is constructed without substrate reinforcements such as a glass cloth or polyurethane foam, improving compressibility over standard thermal pads. The pad's high conformability, in all directions, enables better contact between heat sinks and components.
The self-supporting pad comes in thicknesses from 0.5 to 6.35 mm and provides a thermal conductivity of 1.0 W/m-K at a thickness of 2.5 mm. In addition to featuring a thermal impedance of 0.98° C/W/in.2 at 20 psi, the material features a Shore 00 hardness of 40 at 6.35 mm thick and dielectric breakdown at 6.00 kVac. (Per square inch, from $0.06�samples available now.)
Orcus, Overland Park, KS
Information 913-438-9976
Fax 913-438-7180
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