Project TEST

Viewpoint: Real Innovation in Instrumentation Connectivity

Recently, the Electronic Engineering media have given much attention to test products based on standard backplane architectures derived directly from PCs, or versions specifically modified to handle measurement needs. In some ways, that approach to configuring measurement systems can be beneficial, allowing reuse and reconfiguration of measurement modules.

However, the cost of configuring modular systems and characterizing them to determine their real measurement accuracy is often overlooked…

http://www.nxtbook.com/nxtbooks/hearst/projecttest_200904/index.php?startid=3

Cover Story: Fundamentals of Semiconductor C-V Measurements

Capacitance-voltage (C-V) testing is widely used to determine semiconductor parameters, particularly in MOSCAP and MOSFET structures. However, other types of semiconductor devices and technologies can also be characterized with C-V measurements, including bipolar junction transistors (BJTs), JFETs, III-V compound devices, photovoltaic cells, MEMS devices, organic TFT displays, photodiodes, carbon nanotubes (CNTs), and many others….

DC bias swap of MOSCAP structure during C-V testing

http://www.nxtbook.com/nxtbooks/hearst/projecttest_200904/index.php?startid=5

Design Considerations for Maximizing Throughput and Accuracy in Switch/Measure Instrumentation

As test engineers continue to maximize production efficiencies, they need to become more aware of ways to maximize throughput and thereby decrease test time and the cost of test…

Speed and accuracy considerations

http://www.nxtbook.com/nxtbooks/hearst/projecttest_200904/index.php?startid=12

Trends in RF Testing

The market demand for wireless communications continues to accelerate, along with the shift to data intensive applications, such as texting, web surfing, and GPS usage. These applications require higher transmission rates to make them user friendly, which is creating new approaches to the use of a limited frequency spectrum. More spectrally efficient modulation types and digital coding schemes are being used, along with increased signal bandwidths — from 300kHz in the early 1990s to 40MHz today…

http://www.nxtbook.com/nxtbooks/hearst/projecttest_200904/index.php?startid=19

Solutions for Testing MEMS Devices at the Wafer Level

The MEMS industry is growing rapidly, but early testing is still much neglected. At a glance, manufacturing MEMS devices and classic ICs seem quite similar, but the behavior of MEMS devices is much more complex than classic ICs and differs owing to the MEMS devices having additional mechanical, mostly moveable, parts and packages that are generally a large portion of their cost…

http://www.nxtbook.com/nxtbooks/hearst/projecttest_200904/index.php?startid=24

Taking the measure of pulse generators

In recent years, new testing techniques have been developed to meet the challenges posed by the rapid development of new standards in industries such as semiconductor and communication technology. One such technique is pulse testing…

http://www.nxtbook.com/nxtbooks/hearst/projecttest_200904/index.php?startid=29

For more on Project TEST, visit http://electronicproducts-com-develop.go-vip.net/projecttest