Putty-like gap filler has low thermal resistance

Putty-like gap filler has low thermal resistance

The Sarcon XR-Um-Al is said to be a uniquely formulated silicone gap filler compound with a putty-like consistency and a thin, aluminum carrier film to ease application. The material exibits thermal resistances from 0.06 to 0.10°C-in.2 /W and thermal conductivity of 17 W/m-k, suiting it for heat transfer from CPUs and semiconductors to close proximity heat sinks.

The low-adhesion aluminum barrier nables users to remove the carrier film after installation with no pull-out effect. The compound complies with UL 94V-0 flame retardancy specifications and is available in sheets up to 50 x 50 mm in thicknesses from 0.2 to 0.5 mm. (Contact company for pricing and availability.)

Fujipoly America , Carteret , NJ
Information 732-969-0100

http://www.fujipoly.com/