Colder Products Co. (CPC) claims to have enhanced its LQ Series of non-spill connectors for high-performance computing and data center applications. The company’s quick disconnects (QDs) are designed specifically for liquid cooling applications.
The LQ2, LQ4, and LQ6 Series quick disconnects now feature unique swivel configurations and an integrated thumb latch for easy, one-handed operation in confined spaces such as server racks of large data centers. The maker of quick disconnects has also reduced the force-to-connect by more than 20%.
High-performance computing (HPC) and data center operations continue to migrate to liquid cooling, and here, quick disconnects are emerging as a potential point of vulnerability. According to Dennis Downs, CPC’s business manager for liquid cooling products, LQ Series couplings are leak-free and durable enough to withstand years of use and corrosive fluids.
Downs added that CPC’s couplings and quick disconnects are easy to use in tight spaces and that they are tested to 10,000 cycles, which is twice as much as most non-spill connectors.
The LQ Series quick disconnects feature a multi-lobe seal for redundant protection against leakage and lasting shape retention during extended periods of connection. These multi-lobe seals provide greater sealing efficiency than standard O-rings while requiring less force to connect.
Next, the non-spill design allows disconnection under pressure without leaks, a crucial factor in protecting electronics from exposure to fluid and enabling hot swapping of equipment.
The LQ4 and LQ6 quick disconnects can handle twice the original side load force and feature a 38% higher burst pressure rating than before, offering additional protection from rough handling or use. The upgraded LQ4 and LQ6 Series quick disconnects join the LQ2 Series, which, according to CPC, is the highest-flow capacity 1/8-in. connector in the liquid cooling industry.
The LQ2 Series connectors offer a 22% better flow coefficient than other 1/8-in. connectors. And higher flow capacities reduce pressure drops by an average of 34%, optimizing liquid cooling system performance.
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