Rehm wins New Product Innovation Award at Apex

The team at Rehm Thermal Systems has been celebrating at Apex following the company's successful win at Apex in the Circuits Assembly NPI awards for its Vision XP Quad Lane Convection Reflow Oven.

Sponsored by Circuits Assembly Magazine the Awards are designed to recognize leading new products during the past 12 months. An independent panel of practicing industry engineers selected recipients. The Vision XP Quad Lane Convection Reflow Oven was selected by the judges as the best in its Reflow Soldering category in relation to criteria such as innovation, throughput improvements, quality contribution, cost benefits and environmental consideration. Presented to Global Sales Director Michael Hanke during a ceremony held on Tuesday 19th February in San Diego, the award saw Rehm Thermal Systems top the competitive Reflow Soldering category. 

The challenge to increase capacity within a fixed floor space was met by the VisionXP with its 4 lane, single process tunnel and 48% spacing saving. The system has auto adjustable, asynchronous tracks that offer high throughout with 10 seconds/PCB required for soldering. Optimised heat transfer and precise profiling are important for energy efficient soldering and for this reason each heat zone is equipped with its own fan. Homogenous heat input is achieved with short heat zones (350mm), enabling precision adjustable temperature profiles. The VXP has an ingenious conveyor system with the centre support being ‘thermally invisible’, i.e. no heat carried over from one heat zone to the next.

Commenting on the VXP  recent industry accolade, Michael Hanke  explains: “Naturally, it’s fantastic to be recognized by the industry in this way – especially in a category that we know is always so hotly contested. The appeal of the Vision XP Quad Lane lies in its space saving build, allowing manufacturers to increase capacity within a fixed floor space. We’re delighted it has been received so well by the industry and our customers in particular, and look forward to seeing it in more action throughout 2013.”

Each year there’s a few true, exciting innovations,” said Mike Buetow, editor-in-chief of CIRCUITS ASSEMBLY. “The judges this year noted significant advancements in data collection and analysis and direct, real-time feedback across many equipment lines.”