Renesas unveils dual-core, low-power BLE SoC

Renesas Electronics has introduced its lowest power consumption and smallest multi-core (Cortex-M33, Cortex-M0+) Bluetooth Low Energy (LE) system-on-chip (SoC). The DA14592 BLE SoC, balancing tradeoffs between on-chip memory and SoC die size, targets applications such as connected medical, asset tracking, human interface devices, metering, PoS readers and “crowd-sourced location” (CSL) tracking.

The solution’s new low-power mode is reported to offer “world-class” 2.3-mA radio transmit current at 0 dBm and 1.2-mA radio receive current. Supporting an ultra-low hibernation current of 90 nA, the DA14592 extends shelf-life for end-products shipped battery connected and supports ultra-low active current at 34 µA/MHz for products that require significant application processing.

(Source: Renesas Electronics Corp.)

From a solution cost perspective, the DA14592 requires only six external components, Renesas said. Operating from only a system clock and a highly accurate on-chip RCX, the device eliminates the need for a sleep mode crystal in most applications. The small footprint DA14592 also includes a high-precision, sigma-delta ADC, up to 32 GPIOs. Unlike other SoCs in its class, it offers a QSPI supporting external memory (Flash or RAM) expansion for applications that require extra memory.

All external components required to implement a Bluetooth LE solution is integrated into the DA14592MOD module for the fastest time-to-market and reduced overall project cost, Renesas said. The module delivers design flexibility by routing the DA14592’s functions to the outside of the module and using castellated pins for easy and low-cost module attachment.

A key application for the DA14592 and DA14592MOD is crowd-sourced locationing, or CSL, a market projected to reach over $29 billion in North America by 2031. Renesas will offer reference designs that help accelerate tag designs and enable manufacturers of lost or stolen products to easily attach the DA14592, making their product globally locatable. In addition, the DA14592MOD removes the need for worldwide regulatory certifications, reducing development costs and further accelerating time-to-market, the company said.

Offered in WLCSP (3.32 × 2.48 mm) and FCQFN (5.1 × 4.3 mm) packages, the DA14592 is currently in mass production and the DA14592MOD is expected to receive worldwide regulatory certifications in the second quarter of 2024. Renesas has combined the new DA14592 with a variety of its compatible devices from its portfolio to offer technically vetted Winning Combinations, including the Instrument Panel for Light Electric Vehicles.