Advancements in the electronics industry have led to a significant increase in the power densities, which, in turn, have driven the development of smaller and smarter products. The need for advanced heat dissipation solutions in these smaller products is critical and is expected to drive the industry growth in the near future, according to a new report from Grand View Research.
Some chip-cooling solutions have evolved over the past few years to accommodate the increase in heat flux. Manufacturers are working on the development of advanced cooling solutions based on multi-phase heat transfer technologies. Technologies such as jet impingement mechanisms, cold plates, and heat vapor chambers have revolutionized these systems. However, various component and system level technological issues, such as the heat effect on transistor operation, spatial and temporal variation in the heat load, multiple heat transfer interface, and acoustic noise emissions, are presumed to challenge technological advancements. These challenges are expected to impact the market growth negatively over the forecast period.
North America thermal management technologies market by application, in USD Million (Grand View Research)
Thermal management hardware is expected to remain the leading segment over the next eight years, owing to the increase in the production of miniaturized microprocessors. The hardware product segment has benefited significantly from the increased implementation of heat removal solutions in high-volume commodity systems. Thermal management interface products are estimated to witness a significant growth over the forecast period. The growth in this segment can be attributed to the increasing implementation of interfaces in the automated assembly. These interfaces are regarded as the key heat dissipation solutions for portable and compact electronic devices. The smartphone and the tablet material market have witnessed a considerable growth in the past decade. Owing to the sensitivity toward the weight and the costs, these markets are envisioned to rely largely on advanced materials for cooling solutions rather than secondary heat sinks.
The applications analyzed in the report include computers, renewable energy, automotive, telecommunication, and consumer electronics. Computers dominated the overall industry share in 2015 and are expected to retain their dominance over the next few years. This growth can be attributed to the increasing demand for these solutions to optimize the computer-cooling process to control a large amount of heat produced during the operation. The rise in the operating frequencies for improved performance and the continued reduction in the size of ICs and other components are anticipated to drive the growth in the coming years.
Automotive electronics is expected to witness a significant growth over the forecast period, owing to the rising complexity, value, and quantity of electronics in the passenger, as well as the commercial heavy-duty vehicles. This rise has led to the development of advanced products that offer adequate heat dissipation, grounding, and shielding to the components, as well as the equipment. The development of electric vehicles has driven the need for heat removal in electric motors. The report also breaks down thermal management by global area and lists the key players in the market. For more information: http://tinyurl.com/jbo5pad
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