Rohm and TDK-EPC have joined forces to provide an alternative solution for embedded die technology. This SiP module is a second-source supply of the Texas Instruments MicroSiP DC/DC Converter. Although fully compatible, the process and cost structure is very different from the previously analyzed TI module with a packaging performed by AT&S.
Embedded die packaging is an emerging solution to increase the integration in mobile products. This technology is supported by a game-changing, low-cost, panel-based PCB infrastructure that has the potential to create an alternative supply chain for today’s well established packaging standards.
This report provides complete teardown of the Embedded die package with:
– Detailed photos
– Material analysis
– Schematic assembly description
– Manufacturing process flow
– Cost analysis, step by step
– Manufacturing cost breakdown
– Selling price estimation
The SiP module would be a second-source supply of the TI MicroSiP dc/dc converter. It is used for smartphone applications, featuring a 6-MHz, 1.82-V output with 90% efficiency.
The research is a reverse costing analysis that does a teardown, costing, and selling price analyses.
For more information call 800-526-8630 or go to
http://www.researchandmarkets.com/reports/2383262/rohm_dcdc_micro_converter_tdkepc_embedded_die
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