Reworkable edgebond adhesive dramatically enhances thermal cycle performance of an IC pacakge

A new approach to enhancing the board level reliability of area array packages was presented at the recent SMTA International, an industry-leading conference on electronics assembly and advanced packaging.  John McMahon, et. al. presented work, performed at Celestica, that demonstrates that a reworkable edgebond adhesive, manufactured by Zymet, takes a 55-mm LTCC CBGA out to over 3000 cycles of 0ºC to 100ºC cycling without failure, a dramatic improvement over a non-reinforced component.