ROHM begins industry’s first foundry business based on MEMS and thin-film piezoelectric elements

ROHM has recently established a process for MEMS (micro electro mechanical system) using thin-film piezoelectric elements, and implemented a foundry business that is said to be the first based on the process. The business integrates product design and manufacturing processes from wafer pulling to mounting to meet a variety of customer needs.

Piezoelectric elements, which possess the inherent property of generating a voltage when pressure is applied, are incorporated into a wide variety of electronic devices, from conventional inkjet printheads to autofocus systems in infrared and standard cameras. Combining these elements with MEMS technology, which is commonly used in accelerometers and gyroscopes, makes it possible to simplify design and reduce the size of processing controllers, contributing to increased performance, lower costs, and greater end-product miniaturization.

In addition, the energy-saving characteristics of the piezoelectric element itself, which requires very little power during standby, are garnering increased attention – particularly in the sensor market where explosive growth is expected.

ROHM is actively engaged in the research of thin-film piezoelectric elements. Based on the findings of Professor Isaku Kanno of the Graduate School of Engineering at Kobe University on evaluation measurement methods for thin-film piezoelectric elements, and by taking advantage of development synergy created by combining the collective production technologies of the entire ROHM Group, which includes ROHM's ferroelectric technology cultivated for long-term memory, LAPIS Semiconductor's high-sensitivity MEMS/mounting technology, and Kionix's MEMS miniaturization technology, we were able to establish a manufacturing process at LAPIS Semiconductor Miyazaki and provide piezoelectric MEMS optimized for a variety of markets and applications.

ROHM's MEMS processes using thin-film piezo elements offer five key advantages:
1. Integrated production system, from wafer pulling to mounting, enables complete control of product manufacturing for unsurpassed quality and flexibility.
2. 1,500-m² clean room built for specifically for IC microfabrication.
3. 6-in. wafers used (8-in. wafers planned)
4. Round-the-clock operation speeds up development while enabling early production startup
5. Expanded production capacity

Applications include Accelerometers, gyroscopes, pressure sensors; Inkjet printheads; infrared sensors and cameras; autofocus function in cameras, microphones and speakers, actuator/nozzle control, and energy harvesting.