Roundup: Audio/Video ICs

Consumers are constantly demanding a more-compelling video content experience, better audio quality, and the ability to stream content and connect devices in the home and on the go. Read on for some new products with these features.

 NXP Semiconductor offers the TFA9890 speaker driver IC, which enables an unprecedented 9.5-V boost voltage from an integrated dc/dc converter. Increasing the voltage headroom in the audio driver IC prevents amplifier clipping and keeps sound quality high at maximum volume. The TFA9890 safely drives a record 4 W of peak power into a standard 8-Ω speaker that is typically rated at 0.5 W, making a clear improvement to the sound output and quality of mobiles, tablets, TVs, and portable speakers.

NXP's TFA9890 with 9.5-V boost voltage. Shown is the part's 'Sound level measurement' graph – frequency vs sound pressure level

 Maxim Integrated Products offers the MAX98096 smart audio hub that integrates the company's FlexSound processor, which supports a plug-in-capable audio framework. With low power consumption and advanced audio signal processing, this single-chip audio solution supports wideband voice, including noise cancellation and echo suppression, in a wide range of portable applications. It improves time to market, enhances near- and far-field voice performance, improves the performance of speech recognition engines, and enhances audio playback in small form factors with Dynamic Speaker Management technology.

Conexant offers the CX20873 Dolby headphone decoder IC featuring Dolby Digital Plus (E-AC-3) decoder, Dolby Pro Logic II, and Dolby Headphone. The part also includes the company's proprietary advanced voice processing algorithms (VPA) to deliver up to 7.1-channel surround sound for a richer and more-spacious headphone audio experience. The chip is ideal for cross-platform game console headsets, USB headsets, headphones, USB audio adapters, and other game accessories. The VPA offers advanced in-band microphone noise reduction, 3D sound effects, sub-band acoustic echo cancellation, and automatic gain control features. A configuration toolbox allows for fast configuration of the various signal processing algorithms.

Conexant's CX20873 

STMicroelectronics Orly STiH416 SoC – claimed to be the most powerful set-top box IC for multiscreen and gateway, client, and server applications – now supports the Reference Design Kit (RDK) from Comcast. The STiH416 features the advanced dual-core ARM Cortex-A9 MPCore application processor. It is combined with the ARM Mali 3D graphics processor, a dedicated transport processor,and a transcoder for adaptive video streaming.  The RDK from Comcast is a pre-integrated software bundle that creates a common framework for powering tru2way, IP or hybrid set-top boxes and gateway devices and accelerates the development and deployment of next-generation video services. 

Microchip Technology recently launched the JukeBlox 3.2 platform and software development kit (SDK) that supports iOS/AirPlay, Android, Windows  8 (mobile and PC), and Mac. JukeBlox 3.2 operates on all of the company's existing JukeBlox network media processors and modules, and further adds JB Cloud, which enables a compelling new consumer experience by directly streaming cloud-based music services while using mobile devices as remote controls.  This eliminates the need for mobile devices to act as servers, where they consume power and must stop the music to take phone calls or support other personal audio functions, freeing them up to be what they were intended to be-personal communication and Internet devices.  Additionally, the SDK has expanded whole-home audio functionality via JB MultiZone 2.0, enabling more robust and extensive simultaneous synchronized audio streaming and control to multiple JB-enabled devices in the home. This platform includes SoCs and modules for Wi-Fi networking and media processing, an application software layer for mobile devices and control interfaces, peripheral interfaces and control, and GUI options.

Microchip's JukeBlox 3.2

The DSP Group offers the HDClear solution, a comprehensive voice enhancement product for mobile devices. Incorporating proprietary noise cancellation algorithms, this solution dramatically improves user experience and delivers unparalleled voice quality and call intelligibility. HDClear is now available on DSP Group's DBMD2, a new high-performance, low-power, small-footprint SoC for mobile devices, tablets, notebook PCs and SmartTVs.  Offered in a 3.0 x 3.0 x 0.65-mm, 36-pin BGA and 0.4mm ball pitch, the DBMD2 embeds a programmable 32-bit DSP, incorporates advanced connectivity options including four TDM/I2S ports and SLIMbus, and is equipped with a comprehensive software framework.

AKM Semiconductor offers the AK4679 24-bit stereo CODEC that embeds an open-core DSP for audio and voice processing. Features include a stereo cap-less Class-G headphone amplifier, a Class-D speaker amplifier, and a dual PCM interface that connects the stereo CODEC to a baseband IC or Bluetooth IC for sound recording and playback. The PCM interface block includes an integrated sample rate converter that enables asynchronous mixing of audio and PCM data. The part is optimized for low-power operation: 5 mW for recording (stereo) and 3.7 mW for playback (headphone).