Sensor module integrates edge AI

TDK Corp. recently announced the TDK i3 Micro Module, in collaboration with Texas Instruments Inc. (TI). Claiming the first module with built-in edge AI and wireless mesh connectivity, the sensor module integrates TI’s CC2652R7 SimpleLink wireless microcontroller, providing real-time monitoring and TDK’s IIM-42352 high-performance SmartIndustrial MEMS accelerometer and digital output temperature sensor, edge AI, and mesh network functionality in a single unit.

The digital-output X-, Y-, and Z-axis accelerometer features a programmable full-scale range of ±2 g, ±4g, ±8 g and ±16 g, user-programmable interrupts, I3C/I²C/SPI slave host interface, digital-output temperature sensor, an external clock input supporting accurate clock input from 31 kHz to 50 kHz and 20,000 g shock tolerance. The combination facilitates data aggregation, integration and processing, said TDK.

(Source: TDK Corp.)

The i3 Micro Module “smart” sensor node edge implementation can be used with a wide range of production equipment. The advantage of the sensor module is an understanding of the health of machinery and equipment and less downtime through real-time monitoring versus manpower and scheduled maintenance, the company said.

The battery-powered wireless sensor module helps to rapidly predict anomalies in machinery and equipment, while its condition-based monitoring (CbM) enables progress toward smart factories, said TDK. In addition to factory automation and predictive maintenance, target applications also include robotics and HVAC filter monitoring.

Key features include edge AI-enabled anomaly detection, an embedded algorithm for vibration monitoring, accelerometer and temperature sensors, wireless connectivity including BLE and mesh network, USB interface, a replaceable battery, PC software for data collection, AI training and visualization.

How it works: The data detected by the sensors are processed by i3 Micro Module’s embedded edge AI. The data do not need to be aggregated and analyzed in the cloud, minimizing network traffic, said TDK. The modules connect to each other via a wireless mesh network, formed automatically between modules by installing them.

Provided in a small package size of 56 × 41 × 20 mm, the i3 Micro Module solution is expected to be available through most global distribution partners by the fourth quarter of 2023.  TDK demoed the i3 Micro Module at CES 2023.