Silicon-based thermal grease targets bond lines down to 1 mil

Silicon-based thermal grease targets bond lines down to 1 mil

Sarcon SG-26SL silicone-based thermal grease delivers thermal conductivity of 2.6 W/m°K with minimal bleed and evaporation characteristics. The nonflowing consistency of the grease results in grease that suits power converter and high-performance CPU applications with bond lines as small as 1 mil.

The low thermal resistance of the grease provides efficient transfer of heat from board-level components to nearby heat sinks. The grease has a consistent performance over temperatures of –67° to 401°F, and is easy to apply and remove during assembly and rework processes. Packaging options include prefilled syringes and bulk jars for easy stenciling and manual or automated application. (Contact company for price and availability.)

By Carolyn Mathas

Fujipoly America , Carteret , NJ
Information 732-969-0100

www.fujipoly.com/