Simulator features thermal, radiative cooling surface
The CS-100 Thermal Chassis Simulator provides a thermal mass and radiative cooling surface for passive cooling of ADL CPUs. The 100-in.2 chassis is used with its universal mounting pattern, is compatible with all of the company’s PC/104 heat spreaders and pipes, regardless of the CPU. The product contains both M3 and 4-40 hardware, as well as standoffs to support 0.600- or 1.000-in. clearance spreaders.
The thermal simulator is made from Blanchard-ground powder-cast plate aluminum, has a surface flatness better than 0.001 in. across the entire face. The anodizing provides basic emissivity of ≤0.75 and represents the radiative area of an aluminum enclosure with 200-in.2 It is used as development platform for proof-of-concept passive cooling systems. ($299 — available now.)
By Paul O’Shea
Advanced Digital Logic , San Diego , CA
Sales 858-490-0597
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