Small footprint SMDs

The D2-Pak (TO-263) and D2-Pak (TO-268) are packages that offered the smallest footprint surface mount package for 1.2 kV to 1.8 kV power semiconductors by IXYS. It offers higher ‘creepage’ spacing, which enables high voltage power semiconductors to be used in surface mount devices (SMD).

“The market demands smaller footprint solutions for 1.2 kV to 1.8 kV power semiconductors. The main reason for this is the higher power demands which are realized by higher voltages instead of higher current. By using a higher voltage the conduction losses in copper wires are less for power control circuits; therefore, thinner copper conductors or traces on PCB circuits can be used. These SMDs improve energy efficiency, reduce cost, reduce size and reduce weight when used in power electronics,” commented Mr. Jeroen van Zeeland, head of marketing at IXYS Germany.