With package dimensions of 3.0 x 1.8 x 0.8 mm, PowerPAK ChipFET power MOSFETs have a 75% lower thermal resistance, a 33% smaller footprint, and are 23% thinner than TSOP-6 devices. Available in single, dual, and single with Schottky diode configurations with breakdown voltage ratings of 12 and 20 V with a max power dissipation of 3 W.
Single p-channel devices have thermal resistance values as low as 3C/W (junction-to-case) with maximum on-resistance values as low as 0.021 Ω in a 20-V drain-to-source p-channel single-channel device and 0.064 ohms in a dual-channel device. Complementary co-packaged n- and p-channel parts feature on-resistance values of 0.039 Ω for the n-channel component and 0.072 Ω for the p-channel. (From $0.20 ea/100,00012 to 14 weeks ARO.)
Vishay Intertechnology , Malvern , PA
Information 619-336-0860
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