Socket for 0.4-mm pitch, 6×9 BGA packages handles 75 GHz

Able to work with 2.64 x 3.94-mm IC packages having 6×9 ball-grid arrays with 0.4-mm pitch, the GT-BGA-2024 socket operates at bandwidths to 75 GHz with less than 1dB of insertion loss. The socket is designed to dissipate a few watts using a compression screw, but can be customized for up to 100 W with a modified fin design heat sink on top of the screw and adding an axial flow fan. Contact resistance is typically 30 mΩ per pin.

The socket mounts on a PCB with no soldering, uses little real estate, and allows capacitors/resistors to be placed close by. Other passive components can be placed on the back side of PCB by creating custom cutouts in the stiffener plate. The socket has a latching clamshell lid that permits quick IC insertion and change-out. Temperature range is −55°C to 160°C and pricing is $501 in single quantities.