Sockets designed for test and burn-in apps

High-frequency center-probe and CSP/MicroBGA test and burn-in sockets are offered in sizes to 6.5-mm2 with pitches down to 0.3 mm to meet the growing need for testing smaller components. The sockets feature replaceable interposer sets and require minimal handler tooling for a number of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and flash devices.

Rated for a minimum of 500,000 cycles, the sockets feature an operating temperature range from –55° to 150°C, gold-over-nickel-plated heat-treated beryllium-copper compression spring probes, and a signal path of 1.96 mm. (100-lead socket, from $300 — 4 to 5 weeks ARO.)

Aries Electronics , Bristol , PA
Frank Folmsbee 215-781-9956

http://www.arieselec.com