Sockets enable area-array device testing to 200°C

Sockets enable area-array device testing to 200°C

The AR4HT Series CSP sockets accept any area-array device for high-temperature testing up to 200°C and incorporate a low-profile 0.45-mm contact structure (compressed) that is shorter than other low-profile contacts, providing excellent compliance for reliable ATE testing and burn-in. The sockets are successfully used in military, aerospace and geophysical environments, and R&D.

The AR4HT sockets accommodate a variety of area-array devices including BGA, LGA, QFN, DFN, CSP, MLCC and POP as well as bumped die with full and partial arrays. The full socket operating temperature is 55° to 200°C with a life expectancy of more than 10,000 actuations. The socket can accommodate IC devices with a pitch of 0.4 mm or greater as well as mixed-pitch environments. (From $175 — 20 workdays ARO.)

By Carolyn Mathas

Aries Electronics , Bristol , PA
Information 215-781-9956

www.arieselec.com