Software for electronic packaging designs
The AZtec System is software for the modeling and simulation of advanced
electronic packaging designs. The system's features include package
parasitics modeling for interconnect capacitance, inductance, and
skin-effect resistance, as well as modeling of parasitics associated with
pins, bond wires, and vias. Spice file generation is also available.
Simulation features include rapid digital pulse simulation for multiple
coupled transmission lines. Delay, crosstalk, and multiple reflection
effects are modeled rigorously for accurate signal-integrity analysis. The
waveform simulators use a Spice-like circuit description format and
support Spice models for active devices. The AZtec System runs on Sun
Sparcstations. (AZtec System, from $35,000; individual modules, from $10,
000–available now.) Arizona Packaging Software, Inc. Tucson, AZ Larry
Paxton 602-577-8886 Fax 602-577-0687
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