The unique requirements of microelectromechanical systems (MEMS) call for specialized materials. The versatility of epoxies and adhesives are often capable of providing the necessary properties to ensure support and protection from thermal and mechanical shock, vibration, high acceleration, particles, and other physical damage. As epoxies and adhesives continue to make advances, there are advantages in using these systems for die attach, underfill and encapsulation in demanding MEMS packaging requirements. This white paper will focus on how these materials are used and their benefits for MEMs applications.
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