Basics of Ball Grid Arrays (BGAs)
Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are
Tag: White Papers
ESD Susceptibility
Every person who has purchased computer components or any bare electronics is familiar with the silvery sheen of the antistatic bag. While it is common knowledge that
Best Practices in Documentation
PCB manufacturers and assembly houses have the important responsibility of taking someone’s idea and turning it into a reality. CAD files, including Gerbers, are
Epoxies and Glass Transition Temperature
Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation
IC Socket- Carrier for Semiconductor Devices in Finished Product
IntroductionToday’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below 0.4 mm pitch) and high pin counts (over 2000). When these
A superior solution for press-fit pin and receptacle applications
Mill-Max discusses superior solutions for press-fit-style pins and receptacles which are among the most versatile types of interconnection
Guidelines for Component Placement
Functionality is usually the main focus the first time someone designs a circuit
Electromagnetic Conformance Testing
Over the last century, the use of the electromagnetic spectrum has undergone a monumental
North American and International Power Mains
In this white paper, we will discuss National Power
How to order IC Sockets
Many products are designed with today’s high-performance Integrated Circuits