TDK Corp. has introduced the FS1412, an ultra-low-profile microPOL (μPOL) power module, designed for space-constrained applications. The FS1412, measuring 5.8. × 4.9 ×1.6 mm, joins a new series of µPOL DC/DC converters with increased performance, small size, and simplified integration for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT networking, telecommunication, and computing enterprise, said TDK.
The FS1412 μPOL DC/DC converters integrate a pulse-width modulation (PWM) controller, MOSFETs, an inductor, and capacitors. The μPOL technology enables the integrated DC/DC converters to be placed near complex chipsets such as ASICs and FPGAs.
“By minimizing the distance between the converter and the chipset, the resistance and the inductance components are minimized, allowing for fast response and accurate regulation with dynamic load currents,” said TDK. These solutions use high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve a smaller size and lower profile by using 3D integration.
The new µPOL DC/DC converter series operates at a broad junction temperature range from -40°C to 125°C. They feature a high current density of more than 1000 A per cubic inch. Built-in protection features include soft-start protection, over-voltage protection, thermally compensated over-current protection with hiccup mode, and thermal shut-down with auto-recovery. The devices are lead free and RoHS/WEEE compliant.
The series delivers 12 A with the lowest commercially available height at 1.6 mm, while offering 50% less solution size than the other products available in its class for lower cost and reduced board size, said TDK.
The FS1412 will be showcased at APEC in TDK booth #814, along with a range of power solutions. Volume production for the FS1412 started in the fourth quarter of 2021.
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