TDK’s ultra-small SESUB-PAN-D14580 Bluetooth module now at Mouser Electronics

Mouser Electronics, Inc. is now stocking the SESUB-PAN-D14580 Bluetooth v4.1 module from TDK. This ultra-compact, Bluetooth 4.1 Low Energy (LE) micro module is the world’s smallest module for Bluetooth Smart devices. The 3.5mm × 3.5mm × 1mm SESUB-PAN-D14580 module is based on TDK’s proprietary Semiconductor Embedded in Substrate (SESUB) technology, reducing the size by 60 percent compared to modules using discrete components. The single-mode module’s ultra-compact footprint and low current consumption make it ideal for battery-powered wearable devices where small size, light weight, and low power consumption are essential.

The TDK SESUB-PAN-D14580 Bluetooth module, available from Mouser Electronics, integrates a Dialog Semiconductor DA14580 Bluetooth 4.1 chip, 32-bit ARM Cortex-M0 microcontroller, and DC-DC converter onto a thin substrate, along with all peripheral circuitry including a 16MHz crystal, inductor, and capacitor. All inputs and outputs (I/O) from the substrate layers are routed to a ball grid array (BGA) footprint on the module’s bottom surface. Interfaces include UART, SPI, and I² C, helping to speed the hardware design process and allowing fast and easy implementation of Bluetooth connectivity. The low-power module requires a voltage supply of 3.0V, and consumes only 5.0mA when transmitting, 5.4mA when receiving, and 0.8µA in standby mode. Output power is rated at 0 dBm (typ.), with a communication range of 10 meters, depending on line of sight and antenna characteristics.

The SESUB-PAN-D14580 Bluetooth v4.1 module targets healthcare and fitness devices, wearable devices, home and entertainment devices, and computer peripheral devices.

To learn more, visit http://www.mouser.com/new/tdk/tdk-bluetooth-micro-modules/.