TE Connectivity (TE) has expanded its small form-factor pluggable (SFP) product portfolio with SFP double density (SFP-DD) products for input/output (I/O) interconnects. The “double density” new cages and surface-mount connectors offer two-channel data transmission compared to the traditional one-channel in an SFP architecture. This helps data center systems to enable doubled port density with faster data transfer rates, said TE. The additional area in the double density cages also helps dissipate more heat.
Designed for high-speed I/O data transmission, the SFP-DD products offer higher density and better signal integrity compared to SFP28/SFP56 products, while using less PCB and faceplate space compared to QSFP28/QSFP56 devices. SFP-DD connectors feature a two-lane interface and can provide data rates up to 28G NRZ and 56G PAM-4 protocols with a roadmap to 112G PAM-4, up to 56 Gbits/s or 112 Gbits/s, said TE.
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Both new cages (1 x 1, 1 x 4, 1 x 6, 1 x 8) and connectors are backwards compatible to existing SFP products, which enables easy upgrades to existing SFP series applications. They offer customizable solutions for thermal management, cable length, and stacked configurations. Coupled with TE’s thermal bridge technology, which delivers 2× better thermal resistance versus traditional thermal technologies such as gap pads or thermal pads, the interconnects deliver improved thermal management.
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