TE Connectivity’s microQSFP connector

Presented as the next generation of pluggable input/output (I/O) interconnects, micro Quad Small Form-Factor Pluggable (microQSFP) connectors help solve key challenges relating to bandwidth, thermal performance, and energy costs in data storage centers. The microQSFP overcomes the limits of standard I/O connectors due to their size and external heat sink, delivering QSFP28 functionality in a smaller form factor while providing significantly better thermal performance, improved electrical performance at 25 Gbits/s, and 33% higher density than QSFP, allowing more ports on a standard line card. Built-in fins eliminate the need for additional clips and heat sinks and allow faceplate airflow to the interior of the equipment.

The connectors support 56-Gbits/s performance with backward compatibility to 28 Gbits/s. The products are said to be the first to market resulting from the efforts of the microQSFP Multi-Source Agreement (MSA) group to create an industry-wide ecosystem for microQSFP, and ensure that products can be easily adopted and integrated into existing data center designs.