Master Bond's unique glob top compounds are formulated ideally for the encapsulation of semiconductor chips and wire bonds mostly in chip on board (COB) applications. These glob top compounds offer protection against moisture, chemicals and contaminants. Moreover, they minimize the thermal mismatch between chips and substrates. They also provide mechanical support and electrically insulative properties.
A glob top is a precisely measured and applied drop of specially formulated epoxy that is applied over a microelectronic circuit and its connecting wires. Most notably, glob tops are used in chip on board (COB) applications to protect the circuit from contaminants, facilitate thermal dissipation and minimize the thermal mismatch between the chip and substrate. In addition, glob tops provide dielectric insulation for the circuit as well as mechanical support. Glob top adhesives are available as two part epoxies, one part heat curable epoxies and as UV curing systems.
Glob top adhesives are typically thixotropic materials; while they are flowable during application, their viscosity becomes great enough that they do not flow or move after placement. This assures that the epoxy is present at the necessary locations, while at the same time preventing deposits of adhesive from gathering in areas where it could adversely affect the function of delicate assemblies.
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